{"id":2382,"date":"2014-10-04T16:48:00","date_gmt":"2014-10-04T14:48:00","guid":{"rendered":"https:\/\/www.institut-foton.eu\/?p=2382"},"modified":"2025-04-22T12:10:57","modified_gmt":"2025-04-22T10:10:57","slug":"3d-optical-many-cores-3d-many-core-architectures-based-on-optical-network-on-chip","status":"publish","type":"post","link":"https:\/\/www.institut-foton.eu\/en\/3d-optical-many-cores-3d-many-core-architectures-based-on-optical-network-on-chip\/","title":{"rendered":"3D OPTICAL MANY CORES\u00a0: 3D many-core architectures based on optical network on chip"},"content":{"rendered":"\n
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October 2014 \u2013 September 2017<\/p>\n\n\n\n

CominLabs<\/a> project<\/p>\n<\/div>\n\n\n\n

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Investigation on how novel optical technologies could improve energy efficiency and data rate of on-chip interconnects used in many-core microprocessor architectures.<\/strong><\/p>\n\n\n\n

Context<\/h2>\n\n\n\n

Optical solutions are attractive to provide the required throughput in 3D many-cores architectures. Massive transport of information has been demonstrated in optical communications in excess of 100 Tbit\/s using WDM and even more than 1 Tbit\/s using a single laser. It is clear that the introduction of high-speed on-chip modulation (using e.g. silicon modulators) and WDM technologies would also provide orders of magnitude improvements in throughput for interconnects, provided conditions are met with respect to energy consumption and footprint. However, a number of challenges remain such as the CMOS compatibility of the photonic layer within the microprocessor or the choice of optical network strategy.<\/p>\n\n\n\n

Goals<\/h2>\n\n\n\n

The 3D Optical Many Core project is based on 4 challenges :<\/p>\n\n\n\n